Eric Hatty
VP Commercial
Explore Radiac
Eric Hatty
VP Commercial
Radiac expertise
The composition of our abrasives with an optimized diamond quality, a special bond system and a unique carrier body design, which is manufactured by Asahi, guarantees lowest grinding forces during the grinding process. In combination with a grit size of less than 1 μm results in improved surface quality and greatly increased flexural strength of up to 100%.
In addition, our specialists will help you to make process adjustments and thus achieve excellent profitability of your production.
Pioneering work
We offer our customers in the electronics industry a range of high-quality surface grinding wheels that make a difference in the market.
The product range for grinding wafers enables the highest quality surfaces to be achieved with significantly improved breaking strength. This is achieved thanks to an innovative process design by our application experts and the continuous development of our products. The following are the most important advantages:
CENTURIA-E achieves the highest quality surfaces with a significantly improved die strength ratio for the surface grinding of wafers. Optimized diamond qualities, a special bond system and a unique core design produced at Asahi, guarantee lowest grinding forces. In combination with specific process adjustments, outstanding economic efficiency can be reached.
Customized
Successful companies expect process know-how and comprehensive consulting services from their partners.
Together with the customer, our application engineers analyze the task at hand, create customized solution proposals and implement them on site on the machine.