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Product information
Description
In combination with specific process adjustments an outstanding economic efficiency can be reached.
Features
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Improved Die Strength Ratio:
The combination of a grit size of only 1 μ, optimized diamond quality with specific bond system and a special core design, allows to reach extremely high Die Strength Ratios during the wafer production.
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Shorter Grinding times:
The use of best diamond qualities embedded in a high performance bond system delivers higher stock removal rates and shorter grinding cycles.
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Stock range:
To ensure rapid availability, Tyrolit offers a comprehensive stock range of standard specifications.
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- English (US)
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