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Product information
Description
Latest diamond qualities, maximum grain volume and adapted bond systems characterise the new SKYTEC XD-2 product line. The grinding tools impress with an extremely high removal rate, at the same time reduced wear and optimal chipped edges on the ground workpiece.
Features
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Highest Lifetime:
Long service life and thus shortened non-productive process times are achieved by a strong bonding strength of the diamond grain in ceramic bond.
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High cutting-edge quality:
Due to the special combination of diamond and bond content the high quality requirements in PKD/ PCBN machining can be fulfilled optimally.
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Reduced grinding times:
New diamond qualities in combination with the stronger bond system leads to increased stock removal rates and short grinding cycles.
Abrasive Grain
- Diamond (D)
Bond Classification
Vitrified
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