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Product information
Description
The product assortment for backgrinding of wafers allows to reach highest quality surfaces with a significant improved Die Strength Ratio. The composition of optimized diamond quality, special bond system and an unique core design produced with an innovative production technology at Asahi, guarantees lowest grinding forces during the grinding process. In combination with specific process adjustments an outstanding economic efficiency can be reached.
Features
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Improved Die Strength Ratio:
The combination of a grit size of only 1 μ, optimized diamond quality with specific bond system and a special core design, allows to reach extremely high Die Strength Ratios during the wafer production.
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Shorter Grinding times:
The use of best diamond qualities embedded in a high performance bond system delivers higher stock removal rates and shorter grinding cycles.
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Stock range:
To ensure rapid availability, Tyrolit offers a comprehensive stock range of standard specifications.
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